Hermetically sealed dies and die attach materials
US5736607A · kind A · utility
4Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 1995 |
| Grant date | Apr 7, 1998 |
| Priority date | — |
| Expiry date | Jun 5, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor die is packaged in a hermetically sealed ceramic dual in-line package (cerdip) with a non-standard polysulfone film, or with a paste made from the film, as a die attach material. A cerdip process heats to temperatures of at least about 380.degree. C. The paste is produced by dissolving the film with NMP or with a blend including NMP, and adding a thixotropic agent. The paste or film forms a bond in a cerdip with less than 5000 ppm moisture without using a getter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.