Peter Farrell
4Patents
4h-index
14Co-inventors
47Inventor score
Filing activity: Jun 5, 1995 → Jun 28, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7166911B2 | Packaged microchip with premolded-type package | Electricity | 22 | Expired |
| US8344487B2 | Stress mitigation in packaged microchips | Electricity | 19 | Active |
| US6893574B2 | MEMS capping method and apparatus | Electricity | 14 | Expired |
| US5736607A | Hermetically sealed dies and die attach materials | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.