Deformable interconnect structure for connecting an internal plane to a through-hole in a multilayer circuit board
US5736679A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 1995 |
| Grant date | Apr 7, 1998 |
| Priority date | — |
| Expiry date | Dec 26, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A novel through-hole interconnect for connecting a power plane conductor to a through-hole includes a central pad connected to the through-hole and a deformable hinge that connects the central pad with the power plane conductor in a multilayer circuit board. The central pad and hinge are defined by a non-continuous area removed from the plane conductor. Preferably this area has a C-shape. During the compression process to join the core assemblies, deformation of the hinge advantageously absorbs the shear forces and allows the power plane beyond the hinge to remain substantially planar. The resulting multilayer laminated circuit board includes a plurality of cores laminated together in a stacked configuration and a plurality of plated through-holes defined in said multilayer laminated circuit board each of which is connected to a plane conductor by a hinge deformed so that the interconnect area is aligned outside of a plane defined by the plane conductor. The hinged interconnect avoids shearing problems and thereby improves the reliability of the connection between the through-hole and the power plane, increasing the manufacturing yield and reducing costs. Furthermore, the hinged in…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.