Semiconductor device having circuit pattern along outer periphery of sealing resin and related processes
US5736780A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 7, 1996 |
| Grant date | Apr 7, 1998 |
| Priority date | — |
| Expiry date | Nov 7, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flexible circuit board includes an insulating flexible film having a lower surface provided with first wiring patterns having first inner ends, and second outer ends extending to a peripheral area of the insulating flexible film. A semiconductor element is electrically connected to and supported by the first inner ends of the first patterns. A connecting circuit board includes an insulating base substrate having an upper surface provided with second wiring patterns having first inner ends, and second outer ends extending to a peripheral area of the base substrate, and a lower surface provided with external connecting terminals electrically connected to the first inner ends of the second wiring patterns by vias. A resin fills a space between the lower surface of the flexible circuit board and the upper surface of the connecting circuit board so that the semiconductor element is hermetically sealed with the resin. The second outer ends of the first and second patterns are electrically connected to each other, so that the semiconductor element is electrically connected to the external connecting terminals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.