Kei Murayama
127Patents
17h-index
55Co-inventors
89Inventor score
Filing activity: Aug 16, 1996 → May 2, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5736780A | Semiconductor device having circuit pattern along outer periphery of sealing resin and related processes | Electricity | 129 | Expired |
| US5777386A | Semiconductor device and mount structure thereof | Electricity | 69 | Expired |
| US7217888B2 | Electronic parts packaging structure and method of manufacturing the same | Emerging Cross-Sectional Technologies | 67 | Expired |
| US7279771B2 | Wiring board mounting a capacitor | Emerging Cross-Sectional Technologies | 50 | Expired |
| US8137497B2 | Method of manufacturing wiring substrate | Electricity | 34 | Active |
| US7795140B2 | Method of manufacturing substrate | Electricity | 27 | Active |
| US6943442B2 | Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film | Electricity | 24 | Expired |
| US7508057B2 | Electronic component device | Electricity | 24 | Active |
| US7884632B2 | Semiconductor inspecting device | Physics | 23 | Active |
| US6522022B2 | Mounting structure for semiconductor devices | Electricity | 22 | Expired |
| US6081038A | Semiconductor chip package structure | Electricity | 22 | Expired |
| US6303998A | Semiconductor device having a chip mounted on a rectangular substrate | Electricity | 21 | Expired |
| US6538332B2 | Semiconductor device and method of production of same | Electricity | 20 | Expired |
| US7285862B2 | Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film | Electricity | 19 | Expired |
| US7057290B2 | Electronic parts packaging structure and method of manufacturing the same | Electricity | 18 | Expired |
| US7285728B2 | Electronic parts packaging structure and method of manufacturing the same | Emerging Cross-Sectional Technologies | 18 | Expired |
| US7843068B2 | Semiconductor chip and method of manufacturing the same | Electricity | 17 | Active |
| US6420787B1 | Semiconductor device and process of producing same | Electricity | 15 | Expired |
| US6404070B1 | Semiconductor device | Electricity | 15 | Expired |
| US6281592A | Package structure for semiconductor chip | Electricity | 15 | Expired |
| US7420128B2 | Electronic component embedded substrate and method for manufacturing the same | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6831000B2 | Semiconductor device manufacturing method | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6713863B2 | Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion | Electricity | 13 | Expired |
| US6344695B1 | Semiconductor device to be mounted on main circuit board and process for manufacturing same device | Emerging Cross-Sectional Technologies | 11 | Expired |
| US7825423B2 | Semiconductor device and method of manufacturing semiconductor device | Electricity | 11 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.