Method and apparatus for cleaving semiconductor wafers
US5740953A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 1994 |
| Grant date | Apr 21, 1998 |
| Priority date | — |
| Expiry date | May 17, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/12
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and apparatus are described for cleaving a relatively thin semiconductor wafer for inspecting a target feature on a workface thereof by: producing, on a first lateral face of the semiconductor wafer, laterally of the workface on one side of the target feature, an indentation in alignment with the target feature; and inducing by impact, in a second lateral face of the semiconductor wafer, laterally of the workface on the opposite side of the target feature, a shock wave substantially in alignment with the target feature and the indentation on the first lateral face, to split the semiconductor wafer along a cleavage plane essentially coinciding with the target feature and the indentation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.