Wafer transfer system having vertical lifting capability
US5741109A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 1996 |
| Grant date | Apr 21, 1998 |
| Priority date | — |
| Expiry date | May 22, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/137
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer transfer system is operable with a front or side loading wafer carrier to move one or more wafers in a straight line from the carrier to a position in which the wafers are accessible for further processing by movement along the same straight line. The transfer system provides a wafer extractor which employs a plurality of paired fingers of a size and configuration to fit between the spaced, stacked wafers in the carrier. After insertion between the wafers, the fingers are movable by a small amount vertically to lift the wafers off the shoulders of the carrier. The fingers, now supporting the wafers, are movable generally horizontally along a straight line to remove the wafers from the carrier. The fingers are supported from a support structure in a manner which provides clearance for the wafers to pass through the support structure for further processing along the same straight line path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.