Method for the production of a three-dimensional circuit arrangement

US5741733A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Emmerich Bertagnolli · Munich, DE
• Helmut Klose · Munich, DE

Key dates

• Filing date: Jul 15, 1996
• Grant date: Apr 21, 1998
• Expiry date: Jul 15, 2016

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

To produce a three-dimensional circuit arrangement, a first substrate (1) is thinned, stacked onto a second substrate (2) and fixedly connected to the latter. The first substrate (1) and the second substrate (2) in this case each comprise circuit structures (12, 22) and metallization planes (13, 23). At least one first contact hole (16) and one second contact hole (4) are opened, which reach the metallization plane (13, 23) in the first substrate (1) and second substrate (2), respectively, the second contact hole (4) passing through the first substrate (1). The metallization planes (13, 23) of the two substrates (1, 2) are electrically connected to one another via a conductive layer (7).