Process for transferring microminiature patterns using spin-on glass resist media
US5743998A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 19, 1995 |
| Grant date | Apr 28, 1998 |
| Priority date | — |
| Expiry date | Apr 19, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/859
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A process is provided for altering the susceptibility of a portion of a Spin-On Glass layer to etching. The process includes taking a substrate including a layer of positive or negative resist Spin-On Glass and exposing a portion of the Spin-On Glass layer to an electric field or an electron beam. Depending on the particular Spin-On Glass used, exposure of a portion of the Spin-On Glass layer to the electric field or electron beam causes the exposed portion to have either significantly enhanced or reduced susceptibility to etching as compared to the unexposed portion. This enables the exposed and unexposed portions to be differentiated by selectively removing the more etch susceptible portions of the Spin-On Glass layer during development.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.