Patent · US Expired

Method of inspecting a pattern formed on a sample for a defect, and an apparatus thereof

US5744381A · kind A · utility

29Cited by
5References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 12, 1996
Grant dateApr 28, 1998
Priority date
Expiry dateMar 12, 2016

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L22/12
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A pattern defect inspection apparatus comprises a light irradiating portion, a light receive element, a light receive element amplifier, a preparation portion for preparing multi-valued design pattern image data, an offset adjusting portion, a gain adjusting portion, and an inspecting portion. The offset adjusting portion adjusts the offset of the light receive element amplifier such that measurement data of a translucent portion of a pattern on a sample surface corresponds to design pattern image data corresponding to the translucent portion, regarding the translucent portion as a non-transparent portion. The gain adjusting portion adjusts the gain of the light receive element amplifier such that measurement data of a transparent portion of the pattern on the sample surface corresponds to design pattern image data corresponding to the transparent portion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.