Method of planarizing an array of plastically deformable contacts on an integrated circuit package to compensate for surface warpage
US5745986A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 1995 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | Jul 24, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for mounting an integrated circuit includes a plurality of solder balls arrayed on the bottom surface of a package of the integrated circuit on a circuit board. These solder balls provide for surface mounting of the integrated circuit to a circuit board by solder reflow. The array of solder balls can be planarized so that each of the plural solder balls participate in defining a truly planar solder ball contact array for the integrated circuit package. Methods of manufacturing the integrated circuit with a package having planarized solder balls in an array dependent from a bottom surface thereof are set forth. The truly planarized solder ball contact array of the integrated circuit package affords nearly absolute reliability in forming of surface-mount electrical connections between the integrated circuit package and the circuit board on which the package is to mount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.