Method of forming raised metallic contacts on electrical circuits
US5747358A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 1996 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | May 29, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is provided for forming at least one raised metallic contact on an electrical circuit. Generally, this method includes the following steps: providing a composite base substrate which is defined by at least a first conductive layer, a dielectric material and a second conductive layer; removing a portion of the first conductive layer to expose the dielectric material; removing the exposed portion of the dielectric material to the second conductive layer, thereby forming a depression; depositing at least one layer of conductive material on at least side wall portions of the depression; removing the second conductive layer; and completely removing the dielectric material to said first conductive layer thereby forming a raised metallic contact which extends perpendicularly away from the first conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.