Inventor · Round Rock, TX, US

Robin E. Gorrell

15Patents
6h-index
23Co-inventors
66Inventor score

Filing activity: Apr 14, 1992 → Oct 19, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US5276955A Multilayer interconnect system for an area array interconnection using solid state diffusion Emerging Cross-Sectional Technologies 64 Expired
US5786270A Method of forming raised metallic contacts on electrical circuits for permanent bonding Emerging Cross-Sectional Technologies 59 Expired
US5965043A Method for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-vias Electricity 46 Expired
US5847327A Dimensionally stable core for use in high density chip packages Emerging Cross-Sectional Technologies 44 Expired
US6344371B2 Dimensionally stable core for use in high density chip packages and a method of fabricating same Emerging Cross-Sectional Technologies 29 Expired
US5747358A Method of forming raised metallic contacts on electrical circuits Emerging Cross-Sectional Technologies 23 Expired
US5976974A Method of forming redundant signal traces and corresponding electronic components Electricity 6 Expired
US10653006B2 Electrical conductors Electricity 2 Active
US12381107B2 Protective tapes, articles therefrom, and methods of making and using same Electricity 0 Active
US10740669B2 Film assembly and multilayer stack including antenna Physics 0 Active
US10496915B2 RFID tag on flexible substrate Physics 0 Active
US10628727B2 RFID tag on stretchable substrate Human Necessities 0 Active
US10229353B2 RFID tag on stretchable substrate Electricity 0 Active
US11324113B2 Electrical conductors Electricity 0 Active
US11164063B2 Multilayer stack including RFID tag Physics 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.