Grounding clip for IC cards
US5747735A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 1997 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | Mar 6, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/716
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An IC card kit adapted for receiving a circuit board assembly, which assembly includes a generally planar circuit substrate with an electrical circuit and electrical components mounted on a surface thereof. The electrical circuit includes a ground circuit. The kit includes a frame adapted for receiving the circuit board assembly, a receptacle connector for mounting at the edge of the assembly, a pair of cover panels for sandwiching the frame and circuit board assembly, and a conductive grounding clip on the frame for engaging the ground circuit of the circuit board assembly. The clip includes a spring arm for preassembling the circuit board assembly to the frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.