Liu Chen
13Patents
4h-index
32Co-inventors
60Inventor score
Filing activity: Mar 9, 1994 → Mar 17, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5747735A | Grounding clip for IC cards | Electricity | 39 | Expired |
| US5421737A | Universal ejector mechanism for an IC card connector apparatus | Physics | 35 | Expired |
| US9681558B2 | Module with integrated power electronic circuitry and logic circuitry | Electricity | 20 | Active |
| US9564423B2 | Power package with integrated magnetic field sensor | Electricity | 4 | Active |
| US9564578B2 | Semiconductor package with integrated magnetic field sensor | Electricity | 2 | Active |
| US10727151B2 | Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package | Electricity | 1 | Active |
| US10168391B2 | Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto | Electricity | 1 | Active |
| US11632860B2 | Power electronic assembly and method of producing thereof | Electricity | 0 | Active |
| US11127853B2 | Power transistor device including first and second transistor cells having different on-resistances for improved thermal stability | Electricity | 0 | Active |
| US11239127B2 | Topside-cooled semiconductor package with molded standoff | Electricity | 0 | Active |
| US11903132B2 | Power electronic assembly having a laminate inlay and method of producing the power electronic assembly | Electricity | 0 | Active |
| US10290567B2 | Transistor package with three-terminal clip | Electricity | 0 | Active |
| US9385059B2 | Overmolded substrate-chip arrangement with heat sink | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.