Heat exchanger for high power electrical component and package incorporating same
US5749413A · kind A · utility
6Cited by
33References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 23, 1991 |
| Grant date | May 12, 1998 |
| Priority date | — |
| Expiry date | Sep 23, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/908
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power electronics package includes a heat exchanger having a plurality of faces, a plurality of semiconductor devices mounted on the plurality of faces and at least one bus structure for interconnecting electrodes of the semiconductor devices. The package is enclosed by a cover and structure is provided to connect other electrodes of the semiconductor devices to an external circuit. The heat exchanger is of the jet impingement type.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.