Thermal probe assembly with mold-over crimp sensor packaging
US5749656A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 1997 |
| Grant date | May 12, 1998 |
| Priority date | — |
| Expiry date | Aug 18, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/22
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention generally includes a thermal sensor assembly for a vehicle application including an insert molded part having a thermistor/wire sub-assembly and terminal that are assembled with a "F" crimp and resistance welded that are insert molded to a pre-mold or connector that has a shut-off plate seal on the terminal's insulation crimp. The invention provides a more robust package that is resistant to vibration, insulates the terminals from shorting and permits further handling of the sub-assembly without damage to the terminals. Further, the thermistor can be very small and a very small wire can be used to connect the terminal to the thermistor element. Because a smaller thermistor can be utilized, a much smaller probe tip can be design into the thermal sensor assembly. The insert molded part can either be a preform for press-fit applications or a male sensor connector for applications requiring a metal housing. The pre-molded plastic protects the terminals from short circuiting to the sensor shell or other terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.