Peter J. Straub
3Patents
3h-index
4Co-inventors
39Inventor score
Filing activity: Dec 22, 1995 → Dec 7, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6588931B2 | Temperature sensor with flexible circuit substrate | Physics | 1,216 | Expired |
| US5749656A | Thermal probe assembly with mold-over crimp sensor packaging | Physics | 154 | Expired |
| US5764130A | Insert molded open air thermal probe with a protective basket | Physics | 12 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.