Integrated circuit with active devices under bond pads
US5751065A · kind A · utility
105Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1995 |
| Grant date | May 12, 1998 |
| Priority date | — |
| Expiry date | Oct 30, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Active circuitry is placed under the bond pads in an integrated circuit having at least three metal levels. The metal level adjacent the bond pad level acts as a buffer and provides stress relief and prevents leakage currents between the bond pad and underlying circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.