Patent · US Expired

Method for producing a layer with reduced mechanical stresses

US5753134A · kind A · utility

23Cited by

6References

3Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventor

Markus Biebl · Augsburg, DE

Key dates

Filing date	Nov 23, 1994
Grant date	May 19, 1998
Priority date	—
Expiry date	Nov 23, 2014

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2201/0167
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

For producing a layer having reduced mechanical stresses, the layer is composed of at least two sub-layers that are matched to one another such that stress gradients in the two layers substantially compensate. The method is particularly employable in the manufacture of structures in surface micromechanics.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.