X-ray inspection method and apparatus, prepreg inspecting method, and method for fabricating multi-layer printed circuit board
US5754621A · kind A · utility
35Cited by
2References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1996 |
| Grant date | May 19, 1998 |
| Priority date | — |
| Expiry date | Dec 18, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0008
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An X-ray inspection apparatus and method in which an object to be inspected is irradiated with characteristic X-rays containing at least one wavelength which affords a high X-ray absorbance in the object to be inspected. A transmitted X-ray image which has passed through the object to be inspected is detected, and the object to be inspected is inspected on the basis of the transmitted X-ray image. The method and apparatus are utilized to fabricate a multi-layer printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.