Cobalt-tin alloys and their applications for devices, chip interconnections and packaging
US5755859A · kind A · utility
315Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1995 |
| Grant date | May 26, 1998 |
| Priority date | — |
| Expiry date | Aug 24, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/244
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for electrolessly depositing cobalt-tin alloys with adjustable tin contents from 1 to over 25 atomic percent tin is disclosed. The deposited alloy is useful in the electronics and computer industries for device, chip interconnection and packaging applications. When used for chip interconnection applications, for example, the invention replaces the currently used complicated ball-limiting-metallurgy. The invention may also be used to inhibit hillock formation and electromigration in copper wire structures found in computers and micron dimension electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.