Patent · US Expired

Phase shift mask and method for fabricating the same

US5756235A · kind A · utility

8Cited by
4References
14Claims
0Family size

Assignee

Inventor

Key dates

Filing dateSep 17, 1996
Grant dateMay 26, 1998
Priority date
Expiry dateSep 17, 2016

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F1/44
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A phase shift mask provided with an alignment error measuring pattern which is a phase shift film pattern portion formed in a space defined between dense patterns of the phase shift mask having an alternating type pattern structure so that an error in alignment between a chromium pattern and a phase shift film pattern occurring in the fabrication of the phase shift mask can be measured by checking, through a microscope, a wafer provided with a pattern formed using the phase shift mask. The phase shift film pattern portion is arranged on the central portion of a quartz substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.