Process for manufacturing devices using maleimide containing resist polymers
US5756266A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1996 |
| Grant date | May 26, 1998 |
| Priority date | — |
| Expiry date | Jul 15, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/111
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A lithographic process for fabricating a device is disclosed. An area of radiation sensitive material is formed on a substrate. The radiation sensitive material contains a polymeric component The polymeric component is the copolymerization product of a maleimide monomer and at least two other monomers. Acid labile groups are pendant to one of the monomers with which the maleimide monomer is copolymerized. The acid labile groups are pendant to less than 50 mole percent of the monomers that make up the copolymer. The acid labile groups are not pendant to the maleimide monomer. The radiation sensitive material is patternwise exposed to radiation after it is formed on the substrate. The patternwise exposure transfers an image into the radiation sensitive material. The image is developed into a pattern in the radiation sensitive material. The pattern is then transferred into the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.