Sensor and method for manufacturing a sensor

US5756901A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Juergen Kurle · Reutlingen, DE
• Karsten Funk · Stuttgart, DE
• Franz Laermer · Stuttgart, DE
• Michael Offenberg · Lörrach, DE
• Andrea Schilp · Schwäbisch Gmünd, DE

Key dates

• Filing date: Sep 24, 1996
• Grant date: May 26, 1998
• Expiry date: Sep 24, 2016

Classification

• Technology area (CPC G): Physics
• CPC primary: G01P2015/0814
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

In a sensor and a method for manufacturing a sensor, a movable element is patterned out of a silicon layer and is secured to a substrate. The conducting layer is subdivided into various regions, which are electrically insulated from one another. The electrical connection between the various regions of the silicon layer is established by a conducting layer, which is arranged between a first and a second insulating layer.