Display device and method of fabricating involving peeling circuits from one substrate and mounting on other
US5757456A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 1996 |
| Grant date | May 26, 1998 |
| Priority date | — |
| Expiry date | Mar 8, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of fabricating a driver circuit for use with a passive matrix or active matrix electrooptical display device such as a liquid crystal display. The driver circuit occupies less space than heretofore. A circuit (stick crystal) having a length substantially equal to the length of one side of the matrix of the display device is used as the driver circuit. The circuit is bonded to one substrate of the display device, and then the terminals of the circuit are connected with the terminals of the display device. Subsequently, the substrate of the driver circuit is removed. This makes the configuration of the circuit much simpler than the configuration of the circuit heretofore required by the TAB method or COG method, because conducting lines are not laid in a complex manner. The driver circuit can be formed on a large-area substrate such as a glass substrate. The display device can be formed on a lightweight material having a high shock resistance such as a plastic substrate. Hence, a display device having excellent portability can be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.