Multigigabit adaptable transceiver module
US5757998A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 1996 |
| Grant date | May 26, 1998 |
| Priority date | — |
| Expiry date | Oct 2, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4292
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package for containing a high speed electronic assembly has a small physical size, shielding, pluggability, and is capable of operating at multigigabit transmission rates. The package includes a module and a cover which covers at least the top of the module. An optical assembly and a circuit packaging are inserted into the module. The package, with an appropriate cover, can be removed and inserted without disturbing other packages secured on the board. The circuit packaging is electrically connected to the board through bump connectors, while the circuit packaging itself supplies a normal force for insuring the bump connectors are in contact with the board. The package is attached to the board using an attachment member which is separate from the bump connectors. The bump connectors facilitate high speed transmission. Alignment pins may be used to improve mechanical stability, provide feedback indicative of proper insertion, and to prevent bump connectors from contacting the board until the module is properly positioned. Electromagnetic interference shielding may be provided in the cover. The cover and various components of the module serve as heat sinks for the module. The cover…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.