Apparatus and process for removing surface mounted components from printed wiring assemblies
US5758817A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 19, 1996 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Mar 19, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/018
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus comprises (a) at least one heater to heat a printed wiring assembly until solder holding selected electrical components reaches a flow temperature; (b) a presence detector to determine when the printed wiring assembly is properly positioned at a first location after the printed wiring assembly (particularly, the solder holding the electrical components) has been heated by the heater(s); and (c) a vibrator positioned to vibrate a selected portion of the printed wiring board of the printed wiring assembly with a first vibrating intensity for a first time period. The first vibrating intensity and the first time period must be of sufficient strength and duration to detach the selected electrical component(s) from the printed wiring assembly. The presence detector is electrically coupled to the mechanical vibrator to activate the mechanical vibrator when the printed wiring assembly is positioned at the first location. A transport mechanism automatically transports the printed wiring assembly past the heater(s) to the first location. A first transporting conveyor extends from the first location to a second location, which catches and transports the selected electrical compon…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.