Ray Chapman
9Patents
6h-index
5Co-inventors
52Inventor score
Filing activity: Jan 4, 1996 → Jan 7, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5758817A | Apparatus and process for removing surface mounted components from printed wiring assemblies | Performing Operations; Transporting | 23 | Expired |
| US8640360B2 | Integrated water damage restoration system, sensors therefor, and method of using same | Fixed Constructions | 22 | Active |
| US5678775A | Apparatus and systems that separate and isolate precious and semi-precious metals from electronic circuit boards | Emerging Cross-Sectional Technologies | 18 | Expired |
| US5829694A | Apparatus and systems that separate and isolate precious and semi-precious metals from electronic circuit boards | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5887805A | Compositions of metallic and non-metallic components of wiring assemblies and printed wiring boards | Emerging Cross-Sectional Technologies | 12 | Expired |
| US5788167A | Process that separate and isolate precious and semi-precious metals from electronic circuit boards | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6342539B1 | Non-metallic constituent components of printed wiring assemblies and printed wiring boards | Emerging Cross-Sectional Technologies | 4 | Expired |
| US5667156A | Process for the separation and isolation of precious and semi-precious metals from electronic circuit boards | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6300402A | Compositions created by the separation and isolation of the metallic and non-metallic constituent components of printed wiring assemblies and printed wiring boards | Emerging Cross-Sectional Technologies | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.