Method and solution for cleaning solder connections of electronic components
US5759285A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 1996 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Aug 20, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/26
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A composition for cleaning solder to remove flux, flux reaction products, residues, including residues from manufacturing operations such as plating and photoresist residues and other contaminants, without any significant dissolution of the solder especially solder used in fabricating electronic components such as C4 area array flip chip connectors, is provided. The composition comprises a non-aromatic sulfonic acid and a substituted alcohol with a preferred composition comprising 3 weight % methanesulfonic acid and 97 weight % trifluoroethanol. A method for cleaning solder and solder containing components made using the cleaning method and composition of the invention are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.