Plasma processing apparatus
US5759334A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 1995 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Aug 7, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C59/14
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The plasma processing apparatus of the present invention increases the throughput of plasma processing. This objective is achieved by a composition which comprises a processing chamber (10) for performing surface processing of substrates (W) by means of a plasma discharge, load-lock chambers (20R) and (20L) whereto passage from the processing chamber (10) is possible through slots (11R) and (11L) formed in a wall portion (10a) of the processing chamber (10), a gate element (30) which opens and closes the slots (11R) and (11L) from within the processing chamber 10, and transport element(s) for transporting substrates (W) between the processing chamber (10) and the load-lock chambers (20R) and (20L).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.