Fabrication process using a thin resist
US5759746A · kind A · utility
45Cited by
12References
17Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 24, 1996 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | May 24, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/95
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fabrication process includes a step of providing a substrate to be fabricated. A multi-layer antireflective layer is then formed on the substrate. A patterned resist having a thickness less than 850 nanometers is formed on the multi-layer antireflective layer and the substrate is fabricated using the patterned resist as a mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.