Multi-layer wiring structure having varying-sized cutouts
US5760429A · kind A · utility
69Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 1997 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Feb 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit having a multi-layered metal wiring structure with interlayer insulating films therebetween. A small cutout is made in a metal wiring when it is desirous to have the metal wiring touch a contact formed in a through hole passing through said cutout. A larger cutout is made in a metal wiring when it is desirous to have the metal wiring remain spaced from a contact formed in a through hole passing through said cutout.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.