Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package
US5760471A · kind A · utility
50Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 1997 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Feb 3, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device including a semiconductor element, and leads connected with the semiconductor element. Each of the leads includes an outer lead part for being connected externally. The semiconductor device further includes a plastic package sealing the semiconductor element and the leads. In the semiconductor device, the outer lead part is exposed to the outside of a side face of the plastic package, and the plastic package is mounted on any base in a standing form by the side face contacting the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.