Photodefinable dielectric composition useful in the manufacture of printed circuits
US5763140A · kind A · utility
1Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 1997 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Feb 10, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A composition and process useful in fabricating circuitry packages with permanent resists is proposed. The proposed composition comprises a carboxy functional resin, an acrylate oligomer, an epoxy functional resin, a butadiene nitrile resin, and a photoinitiator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.