Solid tape automated bonding packaging method
US5763294A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 15, 1997 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | May 15, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A solid tape automated bonding method includes steps of: applying a pattern of a first dry film on a first portion of a copper plate; forming wiring; forming bumps; removing dry film and exposing the wiring and the bumps; selectively laminating an insulator layer onto portions of the exposed copper plate and the wiring; laminating a metal layer on the insulator layer; applying glue on the metal layer, the bumps, and respective exposed portions of the wiring and the copper plate; etching the copper plate thus exposing one side of the wiring as ball pads and exposing one side of the insulator layer; coating solder resist on the exposed bottom side of the insulator layer; removing the glue; attaching a die against the bumps; applying mold compound onto the die so as to fix the die in place; and attaching solder balls onto the ball pads. This method provides relatively high density of wiring and simplification in manufacturing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.