Diamond probe tip
US5763879A · kind A · utility
59Cited by
5References
9Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 16, 1996 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Sep 16, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe for electrical contact with a metal layer of an integrated circuit wherein the probe features a polycrystalline diamond layer coating a fine conductive wire. The diamond coating has exposed pyramidal facets having a density of at least 2000 per square millimeter. The substrate has a radius exceeding one micrometer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.