Insulated gate bipolar transistor having a trench and a method for production thereof
US5763902A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 1996 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Apr 24, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/393
Abstract
An insulated gate bipolar transistor comprises a drain which supports a highly doped p-type substrate layer; a low doped n-type drift layer supported over the substrate layer; a base layer supported over the drift layer including a trench extending into the base layer, and supporting an insulated gate on an upper surface thereof separated from the trench by a highly doped n-type source region, the trench having a highly doped p-type layer at the bottom thereof vertically separated from the source region; and a source layer disposed over the n-type source region and extending into the trench covering the highly doped p-type layer in the trench bottom, wherein an applied voltage to the gate forms a conducting inversion channel in the base layer for electron transport from the source region to the drain, and the highly doped p-type layer in the bottom of the trench collects holes injected from the substrate layer into the drift layer thereby improving latch up immunity for the transistor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.