Method and system for testing an electronic module mounted on a printed circuit board
US5764071A · kind A · utility
32Cited by
14References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 1996 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Jan 5, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/325
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method in system for the testing of the electrical characteristics of an electronic module mounted on a printed circuit board. The method and system monitors selected signals from the Bottom Signal Pads of the electronic module. Thus, eliminating the need for a prototype or specialized printed circuit board in order to perform desired testing of signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.