Dual contact probe assembly for testing integrated circuits
US5764072A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 20, 1996 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Dec 20, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2886
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An assembly for making electrical connections to unpackaged integrated circuits using dual contact probes. The probes are said to be dual contact because they contact both the integrated device under test and the testing circuit. The probes have two tips. One tip is located at the end of each leg of the "U"-shaped probe. In operation, the probes are oriented with the legs of the probes extending horizontally and the tips pointing up and down, contacting the IC under test and the testing circuit. The probes are each made of a single piece of metal, and so provide an electrical connection between the IC and testing circuit. Flexing in the legs provides springiness for assuring good contact. The probes are mounted on a rigid block that is rigidly connected to the testing circuit and IC under test. Alignment plates are used to accurately position the probes. The plates can be horizontal or vertical and they have holes or slots that engage parts of the probes. The holes and slots are placed to provide proper positioning of the probes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.