Die bonding apparatus with a revolving pick-up tool
US5765277A · kind A · utility
37Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1996 |
| Grant date | Jun 16, 1998 |
| Priority date | — |
| Expiry date | Sep 30, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die bonding apparatus for separating a chip from a tested wafer including a plurality of chips and attaching the chip to a lead frame comprising a chip-transferring part for separating the chip from the wafer and transferring the chip to a place where a lead frame is prepared for die bonding; a stage where the transferred chip is placed; a bond head for compressing the chip and the lead frame to bond them together; and a lead frame-transferring part for transferring the lead frame to a predetermined place, the chip-transferring part being comprised of a first rectilinearly moving picking tool and a second revolving picking tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.