Ho Jin
54Patents
9h-index
49Co-inventors
78Inventor score
Filing activity: Jun 9, 1994 → Jun 24, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6121118A | Chip separation device and method | Electricity | 101 | Expired |
| US5765277A | Die bonding apparatus with a revolving pick-up tool | Emerging Cross-Sectional Technologies | 37 | Expired |
| US7450550B2 | Apparatus and method for enhancing transfer rate using a direct link protocol (DLP) and multiple channels in a wireless local area network (LAN) using a distributed coordination function (DCF) | Electricity | 34 | Active |
| US5432380A | Apparatus for tape-mounting a semiconductor device | Emerging Cross-Sectional Technologies | 28 | Expired |
| US5979739A | Semiconductor die bonding apparatus having multiple bonding system | Electricity | 26 | Expired |
| US5684328A | Semiconductor chip package using improved tape mounting | Emerging Cross-Sectional Technologies | 16 | Expired |
| US8176140B2 | Home network device control service and/or internet service method and apparatus thereof for controlling internet services and home network devices based on a script | Electricity | 14 | Active |
| US6207478A | Method for manufacturing semiconductor package of center pad type device | Electricity | 9 | Expired |
| US6787393B2 | Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor package | Electricity | 9 | Expired |
| US6321971A | Die collet for a semiconductor chip and apparatus for bonding semiconductor chip to a lead frame | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6386432B1 | Semiconductor die pickup method that prevents electrostatic discharge | Emerging Cross-Sectional Technologies | 8 | Expired |
| US9164745B2 | Method and apparatus for auto installing application into different terminals | Electricity | 7 | Active |
| US7774425B2 | Content management method and apparatus | Human Necessities | 6 | Active |
| US9626178B2 | Method and apparatus for auto installing applications into different terminals | Electricity | 6 | Active |
| US6392286B1 | Semiconductor chip packaging system and a semiconductor chip packaging method using the same | Electricity | 5 | Expired |
| US10454701B2 | Method and apparatus for providing remote user interface services | Electricity | 4 | Active |
| US8375080B2 | Method and apparatus for transmitting and receiving filtered content based on age limit | Physics | 4 | Active |
| US9252123B2 | Multi-chip package and method of manufacturing the same | Electricity | 4 | Active |
| US7502231B2 | Thin printed circuit board for manufacturing chip scale package | Electricity | 3 | Active |
| US9521556B2 | Communication method using direct link in wireless network and apparatus therefor | Electricity | 3 | Active |
| US9980131B2 | Mobile terminal, device and control method thereof | Electricity | 3 | Active |
| US7323642B2 | Thin printed circuit board for manufacturing chip scale package | Electricity | 2 | Expired |
| US7779030B2 | Method and apparatus for managing content using remote user interface | Physics | 2 | Active |
| US9088458B2 | Method and apparatus for notifying remote user interface client about event of remote user interface server in home network | Physics | 1 | Active |
| US10318277B2 | Method and apparatus for auto installing application into different terminals | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.