Method to reduce particulates in device manufacture
US5766369A · kind A · utility
3Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 1996 |
| Grant date | Jun 16, 1998 |
| Priority date | — |
| Expiry date | Oct 4, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B26/0833
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An improved process for manufacturing semiconductor devices (10). The device, which could be a semiconductor wafer, an individual chip, or a device that has integrated within it semiconductor devices, such as a compact disk drive, is placed or held upside down with its working surface (12) open. The device (10) is struck, causing particulates (18) attached to the working surface (12) to fall free of the device. Alternately, the device could be sharply decelerated to apply the shock. Additionally, the device could be held substantially vertical and rotated to use centrifugal force to separate the particulates away from the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.