Method of transfer molding electronic packages and packages produced thereby
US5766986A · kind A · utility
6Cited by
36References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 1996 |
| Grant date | Jun 16, 1998 |
| Priority date | — |
| Expiry date | Mar 18, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink to encapsulate the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.