Electronic device package enclosed by pliant medium laterally confined by a plastic rim member
US5767447A · kind A · utility
38Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1995 |
| Grant date | Jun 16, 1998 |
| Priority date | — |
| Expiry date | Dec 5, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The bottom and side surfaces of an electronic device, such as an integrated circuit chip or a multichip assembly, are surrounded by a soft gel medium. The gel medium is laterally confined by a rigid plastic rim that is epoxy-bonded in place along its perimeter. A plate, made of plastic or metal, can be attached to the top surface of the rim, in order to provide a cover for the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.