Semiconductor device suitable for testing
US5767527A · kind A · utility
22Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 5, 1995 |
| Grant date | Jun 16, 1998 |
| Priority date | — |
| Expiry date | Jul 5, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a rigid member embedded in a resin package body for supporting thereon outer leads that extend from the resin package body and test pads provided on the outer leads for testing the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.