Tab tape and semiconductor chip mounted on tab tape
US5767569A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 1996 |
| Grant date | Jun 16, 1998 |
| Priority date | — |
| Expiry date | Jan 11, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The method for mounting a semiconductor chip comprises disposing conductive thermoplastic polyimide as a bonding material between an inner lead of the TAB tape and an external connecting electrode of the semiconductor chip, applying pressure to the conductive thermoplastic polyimide by a wedge with heating by a hot stage via the semiconductor chip. The semiconductor chip comprises the external connecting electrode adhered the conductive thermoplastic polyimide. The method for fabricating the semiconductor chip comprises forming a signal line and a protective film, forming an electrode pad on the signal line not provided the protective film, forming a conductive thermoplastic polyimide layer on the semiconductor wafer by spin coating, forming a resist on the conductive thermoplastic polyimide layer and performing an etching with using the resist as a mask. The inner lead of the TAB tape is made of conductive thermoplastic polyimide, not gilded. The flip-chip mounting substrate comprises a semiconductor chip connecting electrode comprising a signal line made of conductive thermoplastic polyimide, a protective film protecting the signal line, and adhering conductive thermoplastic poly…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.