Optoelectronic package including photonic device mounted in flexible substrate
US5768456A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 1996 |
| Grant date | Jun 16, 1998 |
| Priority date | — |
| Expiry date | Nov 22, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4261
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optoelectronic package including an interconnect substrate having electronic components and carrying an optical fiber holder. The holder containing an end of an optical fiber and including an end surface in which is formed alignment openings. A flexible substrate having conductive traces, a first end, a second end, and alignment openings formed proximate the first end, interconnects the holder and the electronic components of the interconnect substrate. A photonic unit is mechanically and electrically coupled to the flexible substrate proximate the first end in precise relation to the alignment openings so as to be aligned with the optical fiber by inserting alignment pins extending concurrently through the alignment openings of the flexible substrate and the alignment openings of the optical fiber holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.