On the use of non-spherical carriers for substrate chemi-mechanical polishing
US5769692A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1996 |
| Grant date | Jun 23, 1998 |
| Priority date | — |
| Expiry date | Dec 23, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate holder assembly for immobilizing an integrated circuit (IC) wafer during polishing is described. The substrate holder includes a base plate sized to support the integrated circuit (IC) wafer, a circumferential restraint member arranged with respect to the base plate to engage the IC wafer's edges and a carrier assembly disposed above the base plate and below the IC wafer. The carrier assembly includes a film having a surface that is characterized by a substantially oblate spheroid or hyperboloid surface of rotation, wherein the surface of the film is capable of supporting the IC wafer in a manner causing the IC wafer to bow according to the surface of rotation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.