Patent · US Expired

High density semiconductor memory device

US5770874A · kind A · utility

7Cited by
3References
17Claims
0Family size

Assignee

Inventor

Key dates

Filing dateNov 10, 1997
Grant dateJun 23, 1998
Priority date
Expiry dateNov 10, 2017

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S257/905

Abstract

A high density semiconductor memory device includes: a semiconductor substrate; and a plurality of memory cell groups formed on the semiconductor substrate, each of the memory cell groups including a plurality of memory cells having one common source/drain region, wherein when a surface of the semiconductor substrate is divided into a plurality of areas which are arranged in a matrix of rows extending in a first direction and columns extending in a second direction intersecting the first direction, the memory cell groups are selectively arranged in the areas such that the memory cell groups are located in every other one of the areas arranged in each of the rows and also in every other one of the areas arranged in each of the columns.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.